Substrate support, substrate processing device and method of placing a substrate

ABSTRACT

A substrate support for supporting a substrate in a processing chamber comprises a frame for carrying the substrate, at least a first fastening means fixedly attached to the frame for aligning the substrate relative to the frame, and at least a second fastening means movably attached to the frame, the second fastening means being movable relative to the frame and/or the substrate. Furthermore, a processing device comprises an edge exclusion projecting over a portion of the surface of the substrate in order to prevent processing of the portion of the surface of the substrate. A part of the edge exclusion may be moved into a gap between the edge(s) of the substrate and the frame element of the substrate support to form a labyrinth seal between the frame element and the edge of the substrate. A method of placing the substrate on the substrate support is also disclosed.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/108,320, entitled “SUBSTRATE SUPPORT, SUPPORT PROCESSING DEVICE ANDMETHOD OF PLACING A SUBSTRATE,” filed Apr. 28, 2008, which is anon-provisional of, and claims the benefit of the filing date of U.S.Provisional Patent Application No. 60/914,553, entitled “SUBSTRATESUPPORT, SUPPORT PROCESSING DEVICE AND METHOD OF PLACING A SUBSTRATE,”filed Apr. 27, 2007, and also the benefit of the filing date of EuropeanPatent No. EP 07107164, entitled “SUBSTRATE SUPPORT, SUPPORT PROCESSINGDEVICE AND METHOD OF PLACING A SUBSTRATE,” filed Apr. 27, 2007, theentire disclosures of which are incorporated herein by reference for allpurposes

BACKGROUND OF THE INVENTION

The present invention relates to a substrate support for supporting asubstrate to be processed in a vacuum processing chamber, the substratesupport comprising a frame for carrying the substrate, and at least afirst fastening means fixedly attached to the frame for aligning thesubstrate relative to the frame by attaching the substrate to the firstfastening means. Furthermore, the invention relates to a substrateprocessing device for processing a substrate, the processing devicecomprising at least one process chamber, processing tools arranged inthe process chamber for processing the substrate, and an edge exclusionprojecting over a portion of the substrate surface of a substratesupported in a substrate support and received in the process chamber forpreventing processing of a portion of the substrate. Moreover, theinvention relates to a method of placing a substrate on a substratesupport.

In the field of processing, e.g. coating, substantially large-size planesubstrates, various processing methods are used, e.g. PVD (physicalvapor deposition) like sputtering, CVD (chemical vapor deposition),PECVD (plasma enhanced chemical vapor deposition), etc. By applyingthese processes, single layers or multi-layer systems are deposited onglass substrates to produce coated panels, display screens, OLED(organic light emitting diode) panels, thermally insulating glasspanels, etc.

Generally, the layer deposition may be provided in static or in dynamiccoating processes. In static coating processes, the substrate ispositioned on a substrate supporting platform to be coated within avacuum coating chamber. The substrate is secured to a support platformwithin a deposition chamber by clamp springs or a clamp frame whilebeing coated.

In order to prevent deposition of particles on the edge or on theunderside of the substrate, the substrate holder may include an edgeexclusion or shadow frame for preventing processing of a perimeterportion of the (upper) substrate surface. A particular shadow framesupported on a shadow frame support within the cavity of a processingchamber is disclosed in U.S. Pat. No. 6,773,562 B1, which isincorporated herein by reference for all purposes. By providing theshadow frame, processing gases and plasma are prevented from reachingthe edge and the backside of the substrate.

In dynamic coating processes, the substrate is fixedly attached to acarrier in order to provide the transport and transfer of the substratebetween the various handling and processing chambers. Usually, thecarrier comprises a frame extending along the edge of the glasssubstrate. The glass substrate is fixed in the carrier by clamp springs.During the deposition of coating particles on the substrate, particlesmay also be deposited on the frame causing particle problems.Particularly, when the carrier is locked in, locked out and transportedbetween various coating chambers, it may be heated up and cooled down atfrequent intervals. Due to thermal expansions of the carrier, the glasssubstrate has no defined position relative to the carrier during theprocessing/coating steps.

A number of problems have been identified with respect to the handlingand processing of large-size substrates. Particularly, in a staticprocess, the transport of glass substrates is difficult and thesubstrate may be damaged, e. g., by displacement of the substratearranged on the supporting platform when positioning and aligning thesubstrate. Furthermore, if the edge exclusion is not properly centeredrelative to the substrate during the processing steps, the amount ofshadowing will be unequal and inexact. Particularly, when depositing anumber of layers in different chambers, re-positioning of the substratemay be required after moving the substrate from one processing chamberinto the next processing chamber.

In dynamic coating processes, an exact positioning of the substraterelative to the carrier (and possibly relative to a shadow frame) isdifficult to maintain during the complete process.

BRIEF SUMMARY OF THE INVENTION

It is an object of the present invention to provide a substrate supportand a coating device allowing an exact alignment of a glass substrate onthe substrate support and preventing the deposition of particles on thesubstrate support.

This object is achieved by the provision of a substrate support, asubstrate processing device, and a method of placing a substrate on asubstrate support. The features of the substrate support and theprocessing device as well as the method are described in detail herein.

A substrate support for supporting a substrate to be processed in avacuum processing chamber comprises a frame for carrying the substrate,and at least a first fastening means fixedly attached to the frame foraligning the substrate relative to the frame by attaching the substrateto the first fastening means. The substrate support further comprises atleast a second fastening means movably attached to the frame, the secondfastening means being movable relative to the frame and/or movablerelative to the substrate attached to the first fastening means,particularly in a direction at least towards and/or away from and edgeof the substrate attached to the first fastening means.

The substrate support may be a substrate carrier for supportingsubstrates to be transported through a number of processing chambers forprocessing the glass substrates, particularly for coating the glasssubstrates. The glass substrates are particularly large-area planesubstrates. Fastening means are means for aligning a substrate, forproviding reference points for positioning the substrate, for engaging asubstrate with the fastening means, and/or for attaching or fixing asubstrate in the fastening means.

The first and second fastening means may comprise a stopper for theabutment of the edge(s) glass substrate, at least one supporting areafor supporting the glass substrate and a clamp spring for fixing theglass substrate. The clamp spring may be a flat spring, a compoundspring, etc. The substrate may be fixed on the carrier and in contactwith the carrier only through the fastening means. No support platformor support surface has to be provided.

Because of the mobility of the second fastening means, thermal movementoccurring during the transport of the substrate through lock chambers,unlock chambers, process and treatment chambers may be compensated.Furthermore, by providing a combination of a fixed fastening means and amoveable fastening means, an exact positioning of the substrate may beobtained.

Particularly, the first fastening means comprises at least a firstretainer and a second retainer. The first and second retainers may bearranged at a first frame element and a second frame element,respectively, near a reference corner of the frame of the carrier. Thesubstrate may be positioned in a reference position by means of thefirst and second retainers in a horizontal plane within the positioningspace enclosed by the frame of the carrier. Thus, the glass substrate isfixedly positioned relative to the perpendicularly aligned first andsecond frame elements of the carrier.

In one embodiment of the invention, the first fastening means isarranged on the frame to define a reference corner for retaining,aligning and/or fixedly attaching the substrate relative to thesubstrate support in a reference position. The carrier comprises areference corner including means for aligning the substrate relative tothe carrier frame. For example, a first fastening means may be providedincluding alignment and fixing means positioned at different sides ofthe reference corner. The alignment and fixing means comprise a retainerfor receiving the substrate, e. g., for engagement of the substrate withthe retainer, provide an abutment for the substrate to bring it into adefined position, and a fixing means which may be closed for fixing thesubstrate in the defined position. The fixing means may be designed toinclude clamp spring.

Particularly, the second fastening means comprises at least a thirdretainer and a fourth retainer. The third retainer and/or clamp and thefourth retainer and/or clamp may be arranged at a third frame elementand a forth frame element, respectively. Particularly, the third and thefourth retainer and/or clamp are arranged at two sides of a corner whichis arranged opposite to the reference corner defined by the firstfastening means.

The first fastening means and the second fastening means may eachcomprise one, two or more retainers for engagement with the edge of thesubstrate. The first fastening means, e.g., the retainers of the firstfastening means, are fixedly connected to a first and second frameelement. The first and second frame elements define a corner which is areference corner for the alignment of the substrate relative to thecarrier. The second fastening means comprises a linear guide means suchthat the retainers positioned at a third and forth frame element of thecarrier are capable of being moved relative to the edge of the substrateand/or relative to the third and fourth frame element, respectively. Inthis way, the retainers of the second fastening means may be engaged anddisengaged with the respective edge of the substrate.

The second fastening means may be movably attached to the substratesupport by means of a linear guide, particularly for guiding theretainer elements on a linear path relative to the frame and/or the edgeof a substrate received in the first fastening means in a directionsubstantially perpendicular to the edge of the substrate. In this way,thermal expansion of the carrier may be compensated as well asproduction tolerances in the substrate size. The glass substrate may bepositioned exactly relative to the frame of the carrier and (ifprovided) to an edge exclusion.

It may be noted that the first fastening means and/or the secondfastening means or components thereof may also be displaceable in adirection parallel to the edge(s) of the adjusted substrate.Furthermore, the term “fixedly attached” does not exclude aconfiguration in which a fastening means is fixed to a frame element byappropriate fixing means.

The second fastening means especially comprises means for exerting aforce in the direction towards the edge(s) of the substrate received inthe first fastening means. The force exerted in the direction towardsthe edge(s) of the substrate may be an elastic force. It may be exertedby an elastic element, e.g., by one or more springs, particularly bypressure springs, provided in the linear guidance(s) of the retainer(s)and/or fixing means. The resulting force exerted on the substrate by thesecond fastening means is substantially directed at the reference cornerin order to keep the substrate in a desired position defined by thefirst fastening means that is fixedly connected with the frame of thecarrier. Furthermore, the linear guide means provide for a movement ofthe second fastening means towards the edge of the substrate and allow,against an elastic force applied by pressure springs integrated in theguide means, to retract the second fastening means from the edge of thesubstrate.

The problem is also solved by providing a substrate processing devicefor processing a substrate, the processing device comprising at leastone process chamber, processing tools arranged in the process chamberfor processing the substrate, and an edge exclusion projecting over aportion of the substrate surface of a substrate supported in a substratesupport and received in the process chamber for preventing processing ofa portion of the substrate. The edge exclusion is adapted to provide alabyrinth seal between an edge of the substrate and a frame element ofthe substrate support.

Particularly, the substrate processing device is a coating device fordepositing a layer and/or a layer system of particular materials on thesubstrate surface. The process chamber may be a vacuum chamber havingprocessing tools arranged therein. The processing tools comprisematerial sources that provide coating material to be deposited on thesubstrate surface. The coating device usually comprises a number ofvacuum coating chambers and/or process chambers to perform a number ofcoating and/or processing steps on a substrate. As the invention is notlimited to particular coating methods, the coating tools may comprisesputter material sources, PVD tools, CVD tools, PECVD equipment, etc.

The carrier/substrate support comprises a frame which defines and/orencloses a space. The space is somewhat larger than the area of thesubstrates to be processed. Therefore, a small gap having a width of afew millimeters is provided between the peripheral edge of the substrateand the frame elements defining the space. The gap may be covered by theedge exclusion.

The term “edge exclusion” is used as a synonym for the terms “shadowframe” or “masking.” The inboard portion (lip portion) of the edgeexclusion extends over a portion of the substrate surface masking atab-like edge portion of the substrate surface, thereby forming a smallclearance between the underside of the lip portion of the edge exclusionand the edge portion of the upper substrate surface. The lip portionprojects inward from the body of the edge exclusion over the substrateedge. The width of the clearance may be constant or variable, e. g.having steps provided in the underside of the projecting lip portion ofthe edge exclusion.

A labyrinth seal in the sense of this invention is a seal which isstructured to form a bent, a curve and/or a winding path between theupper surface of the substrate and components of the substratesupport/carrier such that the probability for particles entering theclearance between the surface of the substrate and the underside of theedge exclusion is very small to reach the frame components (neither in alinear movement nor when being scattered). In other words, the particleshave to pass through a long and difficult path to escape from the areaof the coating chamber in which particles used for the process areprovided.

According to the present invention, the labyrinth seal is formed as apart of the edge exclusion. The edge exclusion projects over portion ofthe surface of a substrate supported by a carrier/substrate support andreceived in the coating chamber in order to prevent processing of aportion of the substrate surface. A part of the edge exclusion may bemoved into the gap between the edge(s) of the substrate and the frame ofthe substrate support to form the labyrinth seal between the frameelement and the edge of the substrate.

The labyrinth seal is implemented by providing a protrusion formed atthe edge exclusion. Particularly, the protrusion is provided to extendinto the gap between the edge of the aligned substrate and the frame ofthe carrier when the edge exclusion is moved close to the carrier. Theprotrusion prevents particles entering the clearance between theunderside of the edge exclusion and the upper surface of the glasssubstrate from passing the gap between the edge of the glass substrateand the carrier components. The protrusion blocks any linear path to theframe or any other component of the carrier for the particles enteringthe clearance.

The labyrinth seal is a non-contact sealing. Hence, there is noconsiderable “bridging” between the substrate and the frame elements.The only contact between the substrate and the carrier is made by theretainers of the fastening means, i.e., the substrate is exclusivelysupported by the first fastening means and the second fastening meanswhich are in contact only with a small portion of the periphery of thesubstrate. Therefore, a defined masked tab around the periphery of thesubstrate may be provided, and bridging between the substrate andcomponents of the carrier may be avoided.

Particularly, the substrate processing device further comprises asubstrate support/carrier, particularly a substrate support as describedabove, for supporting a substrate. The substrate support may support asubstrate and carry the substrate through a number of processingchambers, transfer chambers etc. in order to accomplish a substratetransfer and processing of the substrate. Furthermore, by providing thecarrier according to the invention (particularly in a dynamic coatingprocess), an exact alignment and positioning of the substrate relativeto the carrier, and, if an edge exclusion is provided, relative to theedge exclusion is possible. Thus, a defined shadowed tab along theperiphery of the substrate surface may be obtained. Coating of thecarrier by scattered particles is reduced due to the provision of alabyrinth seal.

The substrate support may comprise a frame and a substrate supported inthe substrate support, the frame being arranged such that a gap isformed between the frame and an edge of the substrate. In fact, thesubstrate support may be loaded with a substrate to form the gap whichis covered by an edge exclusion.

Particularly, the edge exclusion is arranged within the process chamber.In one embodiment, the edge exclusion is coupled with at least acomponent of the process chamber, particularly with a chamber wall.

In this embodiment, the edge exclusion and the substrate supportreceived in the process chamber are arranged movable relative to eachother in order to move at least a portion of the edge exclusion into thegap between the edge of the substrate and the frame of the substratesupport to form the labyrinth seal. The edge exclusion may be coupledwith at least a component of the process chamber and arranged within theprocess chamber movable, e.g., relative to a chamber wall. Particularly,it may be movable relative to the substrate support arranged within theprocess chamber. A relative movement means that the edge exclusion mayalso be fixedly connected with at least a component of the processchamber, and the process chamber may provide means for moving thesubstrate support towards the edge exclusion. Also, both the edgeexclusion and the substrate support may be arranged movable within theprocess chamber and be able to move towards each other and to move awayfrom each other.

Particularly, the edge exclusion comprises a body portion for coveringthe gap between the edge of the substrate and the frame of the substratesupport in order to prevent particles from entering into the gap.

The lip portion of the edge exclusion may comprise an end portion havinga free end projecting over a portion of the substrate surface to form aclearance between the underside of the lip portion and the portion ofthe substrate surface. The free end portion of the lip portion projectsover the portion of the substrate surface in a contactless manner.

The labyrinth seal may furthermore comprise a protrusion extending fromthe edge exclusion into the gap between the edge of the substrate andthe frame element for preventing particles required for the process topass the gap in a direction towards the frame element. A particleentering the clearance is blocked by the protrusion from moving furtherinto the direction of the frame that surrounds the substrate, or intothe direction of other components of the carrier. The protrusion extendsinto the gap along substantially the complete periphery of the edge ofthe substrate. Therefore, a labyrinth seal is provided substantiallyalong the entire periphery of the substrate.

Because the protrusion protrudes downward from the underside of the lipprojection over the peripheral portion of the substrate surfaceconsiderably further than the width of the clearance, a direct linearpath to the frame is blocked by the protrusion. The protrusion is onlyinterrupted at the positions of the fastening means retaining some smallperipheral sections of the edge. The edge exclusion is movably arrangedwithin the process chamber relative to the substrate support such thatthe protrusion is movable into the gap and retractable from the gap whenthe processing step has been finished. Thus, the substratesupport/carrier can be easily transported into and out of the processchamber. The seal prevents particles used for processing the substratesurface from passing the gap entering the clearance in a directiontowards the frame of the carrier.

A method of placing a substrate on a substrate support, particularly ona substrate support described above, comprises the steps of:

-   (a) providing at least a first fastening means fixedly attached to a    frame of the substrate support, and a second fastening means movably    attached to the frame, the second fastening means being movable    relative to the frame;-   (b) moving the second fastening means in an outward direction to    increase a space defined by the position of the first fastening    means and the second fastening means between the first fastening    means and the second fastening means;-   (c) attaching the substrate to the first fastening means;-   (d) moving the second fastening means in an inward direction towards    an edge of the substrate attached to the first fastening means; and-   (e) attaching the substrate to the second fastening means.

Particularly, step (c) includes retaining the substrate in the fasteningmeans, moving the substrate towards abutments of the fastening means inorder to adjust the position of the substrate, and locking the substratein the first fastening means, e.g., by activating a clamp mechanism ofthe fastening means. Step (d) may include retaining the substrate in thefastening means, pressing the substrate in the direction of the firstfastening means in order to stabilize the alignment of the substrate.Furthermore, in step (d) the fastening means may be moved in an inwarddirection by a force directed towards an edge of a substrate attached tothe first fastening means.

In step (e) the second fastening means may exert a force towards thefirst fastening means so as to press the substrate in a direction of thefirst fastening means to maintain it in a position defined by the firstfastening means.

In a further embodiment, attaching the substrate to the first fasteningmeans and/or to the second fastening means is provided by closing aclamp spring of the first fastening means and the second fasteningmeans, respectively, and/or by bringing an edge portion of the substrateinto engagement with the first fastening means and the second fasteningmeans, respectively.

When loading a carrier with a glass substrate, the following steps arecarried out. First, the carrier is placed in a horizontal position. Theclamp springs of the fastening means are opened. The movable retainersare removed against the force of the pressure springs provided in thelinear guidance of the movable second fastening means, therebyincreasing the space defined by the position of the first and secondfastening means. Afterwards, the glass substrate can be received by theretainers of the first fastening means. The substrate is aligned byreference points in the first fastening means, e.g., by abutmentsurfaces, stoppers, etc. provided in the retainers of the firstfastening means.

The substrate may be attached to the first and/or second fastening meansby providing the fastening means with at least a clamp that may beopened and closed when removing the substrate from the fastening meansand attaching the substrate to the fastening means, respectively. Beforetransporting the carrier into a process chamber, the clamp springs ofthe retainers are closed.

In another embodiment, the fastening means may comprise retainers thatdo not have an opening/closing mechanism. The substrate is attached tothe fastening means by engaging the substrate with at least one retainerof the fastening means. The engagement is made by moving the substrateedge into the retainer. The disengagement is made by retracting thesubstrate from the retainer.

This means that in step (c) the substrate is moved in a space betweenthe first fastening means and the second fastening means on a levelappropriate for the engagement with the first fastening means.Afterwards, when the substrate has been attached to the first fasteningmeans, the second fastening means is brought into engagement with thesubstrate by the movement of the second fastening means, particularly byretainers that are suitable for receiving a third and/or a fourth edgeof the substrate.

Afterwards, the movable retainers of the second fastening means arereleased such that the elastic force exerted by the pressure springs ofthe guidance means make the retainers of the second fastening means movetowards the third and fourth edge of the glass substrate until they abuton the respective edge of the glass substrate. The force of the pressuresprings presses the glass substrate into the reference corner of thecarrier.

Particularly, the first fastening means is placed in a reference cornerof a frame of the substrate support, and the substrate is aligned byplacing the substrate in a defined position determined by the firstfastening means.

The first fastening means and the second fastening means may comprise atleast two retainers and/or clamps each. The retainers and/or clamps ofthe first fastening means are fixed with respect to the frame of thecarrier. They define a reference corner for aligning the substraterelative to the carrier. The retainers and/or clamps of the secondfastening means, on the other hand, are movable to be able to movetowards the substrate edge in order to engage with the substrate edge.By providing a linear guide means and an elastic means, the retainers ofthe second fastening means may exert a force towards the edge of thesubstrate, thus pressing the substrate into the direction of thereference corner.

The method may comprise a further step:

-   (f) moving an edge exclusion into a gap between the edge of the    substrate and a frame element of the substrate support.

The general idea of the invention is to use a carrier for the transportof large-area glass substrates as well in a static as in a dynamiccoating process. In order to ensure an exact aligning and positioning ofglass substrate relative to the edge exclusion, a system for thealignment of the substrate on the carrier is integrated in the carrier.Furthermore, in order to prevent coating of the carrier more reliably, alabyrinth seal is used between the carrier components and the substrateedge.

In a static coating process, the edge exclusion is particularlyintegrated in the process chamber. The labyrinth seal is generated bymoving a protrusion of the edge exclusion into a gap between the edge ofthe substrate and the carrier frame before starting the coating process.

In a dynamic coating process, the edge exclusion may be integrated inthe carrier itself, i.e., it may be a component of the carrier. Thelabyrinth seal is provided by the arrangement of the protrusion of theedge exclusion in the gap between the edge of the substrate and thecarrier frame.

Unloading the substrate from the carrier includes performing the stepsof loading in reverse order. i.e., when removing the substrate from thesubstrate support, the second fastening means is moved outwards relativeto the substrate in a direction away from an edge of the substrate.Afterwards, the substrate is removed from first fastening means, eitherby opening the clamp springs of the retainer, or by moving the substratein a direction away from the first fastening means to release thesubstrate from the retainers.

The features described above are claimed in any combination thereof.Particularly, it has been recognized by the inventors that a combinationof the inventive edge exclusion and the positioning mechanism foraligning and fixing the substrate results in a transportable substratecarrier that allows to maintain a permanently exact position of thesubstrate relative to the carrier, and an edge exclusion preventing thesubstrate carrier from being polluted by process particles effectively.

BRIEF DESCRIPTION OF THE DRAWINGS

Further objects and advantages result from the following description ofspecific embodiments relating to the figures.

FIG. 1 is a view of a carrier according to the present invention.

FIG. 2 is a detail view of the reference angular corner according toFIG. 1.

FIG. 3 is a detail view of FIG. 2 including retainers.

FIGS. 4A and 4B are two embodiments of retainers used in a carrieraccording to the present invention.

FIG. 5 is a detail view of the second angular corner including retainersaccording to FIG. 1.

FIG. 6 is a detail view of FIG. 5 including both retainers and linearguides.

FIG. 7 is a view of the linear guide of FIG. 6 in accordance with thepresent invention.

FIG. 8 is a view of an edge exclusion provided in accordance with thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows a substrate carrier 1 according to the present invention.The substrate carrier 1 comprises a frame 2 consisting of frame elements2 a, 2 b, 2 c and 2 d defining and enclosing an interior space or area 3for receiving a substrate 14. A substrate which is somewhat smaller thanthe interior space 3 may be positioned therein and held/fixed within theframe elements 2 a, 2 b, 2 c, 2 d.

The frame 2 has a first angular corner 4 defined by a first frameelement 2 a and a second frame element 2 b, and an opposite secondangular corner 5 defined by a third frame element 2 c and a fourth frameelement 2 d.

The first corner 4 is illustrated in detail in FIG. 2. The first corner4 is called a reference corner due to the fact that it is provided foradjusting, positioning and fixing the substrate relative to the frameelements 2 a and 2 b, relative to the frame 2 and thus relative to thecarrier 1.

The first corner 4 comprises a first retainer 6 and a second retainer 7fixedly attached to the first and second frame elements 2 a and 2 b,respectively, as illustrated in FIG. 3. In this way, a glass substratemay be positioned in a particular orientation relative to the frameelements 2 a, 2 b, 2 c, 2 d and the carrier 1.

FIGS. 4A and 4B illustrate two embodiments of a retainer 6 or 7 used inthe present invention. The retainer 6 or 7 comprises a supportingsurface 8 for supporting a substrate 14. The substrate 14 inserted in aretainer gap 9 may be moved so far as to contact an abutment portion 10of the retainer 6 or 7.

In one of the embodiments, a clamp spring 11 as shown in FIG. 4A isprovided to fix the substrate 14 in a defined position after theadjustment of the substrate 14 in the reference corner 4. The clampspring 11 may have an opening or closing mechanism.

In the alternative embodiment, the retainer 6, 7 may be constructedwithout an opening or closing mechanism as shown in FIG. 4B. Thesubstrate is received and fixed in the retainer 6, 7 by inserting thesubstrate into the retainer gap 9 in a direction indicated by the arrowS and bringing it into engagement with the retainer 6 or 7.

FIG. 5 shows the second corner 5 of the carrier 1 illustrated in FIG. 1.The second angular corner 5 is defined by a third frame element 2 c anda forth frame element 2 d. Third and fourth retainers 12 and 13 areconnected to the third frame element 2 c and the forth frame element 2d, respectively. Basically, the retainers 12 and 13 have the sameconfiguration as the retainers 6 and 7 illustrated in FIG. 4.

However, the third and fourth retainers 12 and 13 are not fixedlyconnected to the frame elements 2 c and 2 d, but movably relative to therespective frame elements 2 c and 2 d. This is indicated in FIG. 6. Thethird and the fourth retainers 12 and 13 are attached to the frameelements 2 c and 2 d, respectively, by means of linear guides 15 and 16.Therefore, the third and the fourth retainers 12 and 13 are movablerelative to the frame elements/members 2 c and 2 d, respectively, in thedirection indicated by arrows c and d in FIG. 6. The direction issubstantially perpendicular to the longitudinal axis of the third andfourth frame members 2 c and 2 d, respectively, and/or substantiallyperpendicular to the edge(s) of a substrate inserted and positioned inthe first and second retainers 6 and 7.

A substrate 14 held by the retainers 12 and 13 may thus conductmovements relative to the frame elements 2 c and 2 d. Consequently,thermal expansion of the carrier 1 may be compensated by the movement ofthe retainers 12 and 13 by means of linear guides 15 and 16 relative tothe third and fourth frame members 2 c and 2 d.

A linear guide 15 or 16 as used in the present invention is shown inFIG. 7. It comprises an attachment portion 17 a provided on a telescopicmember 17 for fixing a retainer 12, 13 thereon. The movable member 17 isguided by a linear bearing 17 b. The movable member 17 performs thelinear movement within the bearing 17 b. A stopper 18 restricts themovement of the movable member 17 in the direction F by contacting anabutment surface 17 c of the movable member 17.

Furthermore, an elastic element (not shown), e.g., a pressure spring, isprovided in a conventional manner such that a force indicated by arrowF, is exerted in the direction of an edge of the substrate 14 (see FIGS.5 and 6). Due to the arrangement of the retainers 15 and 16 in theopposite corner 5, the force resulting from the forces F_(c) and F_(d)provided by the elastic elements of the linear guides 15, 16 urges thesubstrate 14 in the direction of the reference corner 4 and thusprovides a secure and exact position of the substrate in the referencecorner 4 (see FIG. 1). Therefore, the position of the substrate 14relative to the first and second frame elements 2 a and 2 b iscontinuously the same regardless of thermal expansions of the carrier 1,production tolerances of the substrate size, and other variations of thesubstrate size.

The carrier 1 described in FIG. 1 may be used for dynamic or staticcoating processes. Particularly in static coating processes, an edgeexclusion 20 may be used in combination with the carrier 1 as shown inFIG. 8.

The edge exclusion 20 is movably installed inside a vacuum chamber. Itmay be moved in a direction indicated by an arrow M and in the oppositedirection relative to the frame 2 and substrate 14. Alternatively, theframe 2 and substrate 14 may be moved relative to the edge exclusion 20.In a first retracted position (not shown), the edge exclusion 20 isspaced from the frame 2 of the carrier 1 such that a protrusion 20 cdoes not engage with the gap 19 between the outer edge 14′ of asubstrate 14 and the inner edge 2′ of the frame 2 of the carrier 1. Inthis position of the edge exclusion 20, the carrier 1 is positionedwithin the vacuum chamber. Before the static coating process is started,the edge exclusion 20 is moved in the direction M towards the frame 2 inorder to bring the edge exclusion 20 in a second position (as shown inFIG. 8), thus bringing the protrusion 20 c into exact engagement withthe gap 19. Then, the static coating process may be carried out. In thesecond position, the edge exclusion 20 covers the gap 19 (see FIG. 5)between the outer edge of the substrate 14 and the frame elements 2 a, 2b, 2 c and 2 d.

In another embodiment, particularly in connection with a dynamic coatingprocess, the edge exclusion 20 may be fixed to the carrier 1 to be movedthrough the processing stations together with the carrier 1.

According to FIG. 8, the edge exclusion 20 comprises a body portion 20a, a lip/end portion 20 b having a free end and a protrusion 20 cextending into the gap 19 between the outer edge 14′ of a substrate 14and the inner edge 2′ of a frame 2 of the carrier 1. The protrusion 20 cmay extend into the gap 19 to an appropriate extent such that unwantedparticle contamination of carrier components is prevented.

The body portion 20 a substantially extends over the frame 2 and overthe gap 19 along the substantially entire periphery of the edge 14′ ofthe substrate 14 in order to prevent particles from entering into thegap 19 and being deposited on the frame 2.

The lip portion 20 b has a free end projecting over a portion of thesubstrate surface substantially along the periphery near the edge 14′ ofthe substrate 14. The lip portion 20 b is thus the shield or mask forpreventing coating particles from being deposited in the outer edgeregion of the upper substrate surface 14″, on the outer edge 14′ and onthe underside of the substrate 14.

The underside 20 b′ of the lip portion 20 b of the edge exclusion 20 anda portion of the upper substrate surface 14″ near the edge 14′ of thesubstrate 14 form a clearance 21 having an adjustable width. On onehand, the width is set large enough for preventing “bridging” betweenthe edge exclusion 20 and the substrate 14, on the other hand, the widthis small enough to shield a portion o the substrate surface near theedge 14′, the edge 14′ and the underside of the substrate 14 effectivelyfrom particle deposition by particles entering into the clearance 21.Such a clearance 21 allows the free end of the lip portion 20 b toproject over the portion of the substrate surface 14″ in a contactlessmanner.

The protrusion 20 c extending into the gap 19 provides a labyrinth sealfor particles entering the clearance 21. The protrusion 20 c is formedto prevent particles entering into the clearance 21 to be deposited onthe frame 2 by blocking the particles on their (direct) way to the frame2. Particularly, the protrusion 20 c protrudes downward from theunderside of the lip portion over the peripheral portion of thesubstrate surface considerably further than the width of the clearance,such that a direct linear path to the frame is blocked by theprotrusion. Thus, the coating particles are exclusively deposited on thesubstrate surface and on the edge exclusion 20.

Due to the exact positioning of the substrate 14 relative to the frame2, the protrusion 20 c of the edge exclusion 20 (mask) may be movedexactly into the gap 19. This provides for constant conditions during anumber of coating processes carried out in the vacuum chamber.Furthermore, any pollution of the carrier components may be prevented,even when the process chamber is vented (causing particles to bedetached from components arranged inside the vacuum chamber).

The combination of the positioning method and device for attaching thesubstrate to the carrier 1 in a defined position and the edge exclusion20 as described above provides for a secure, exact and permanentpositioning of the substrate 14 relative to frame elements 2 a, 2 b andrelative to the edge exclusion 20. Furthermore, any pollution of thecarrier components by particles used for processing the substrate 14 isprevented. By using the described edge exclusion 20, a defined tab onthe substrate surface can be masked and particles can be prevented frompolluting carrier components. Because of the advantages in positioningthe substrate 14, thermal expansion of the carrier 1 may be compensatedand the quality of the coating near the edges 14′ of the substrates 14may be improved.

1. A substrate processing device for processing a substrate comprising:at least one process chamber; processing tools arranged in the processchamber for processing the substrate; a substrate support having a frameand being received in the process chamber for supporting the substrate;and an edge exclusion projecting over a portion of the surface of thesubstrate for preventing processing of a portion of the substrate,wherein the edge exclusion is adapted to provide a labyrinth sealbetween an edge of the substrate and a frame element of the substratesupport, wherein the labyrinth seal comprises at least a protrusionextending from the body portion of the edge exclusion, wherein the edgeexclusion is movably arranged within the process chamber relative to thesubstrate support such that the protrusion is movable into the gapbetween the edge of the substrate and the frame element.
 2. Thesubstrate processing device according to claim 1, wherein the frame isarranged such that a gap is formed between the frame element and theedge of the substrate supported in the substrate support.
 3. Thesubstrate processing device according to claim 1, wherein the edgeexclusion and the substrate support received in the process chamber arearranged movable relative to each other in order to move at least aportion of the edge exclusion into the gap between the edge of thesubstrate supported by the substrate support and the frame element ofthe substrate support to form the labyrinth seal.
 4. The substrateprocessing device according to claim 1, wherein the edge exclusioncomprises a body portion for covering the gap between the edge of thesubstrate and the frame element of the substrate support in order toprevent particles from entering into the gap.
 5. The substrateprocessing device according to claim 1, wherein the edge exclusioncomprises an end portion having a free end projecting over a portion ofthe substrate surface to form a clearance between the underside of theend portion of the edge exclusion and the portion of the upper substratesurface.
 6. A method of placing a substrate on a substrate support,comprising: providing the substrate support having a frame attaching thesubstrate to the frame; and moving an edge exclusion into a gap betweenthe edge of the substrate and a frame element of the substrate support.7. The method according to claim 19, wherein the step of attaching thesubstrate to the frame includes moving the second fastening means in aninward direction by a force directed towards the edge of the substrateattached to the first fastening means.
 8. The method according to claim6, wherein attaching the substrate to the first fastening means and/orto the second fastening means is provided by closing a clamp spring ofthe first fastening means and the second fastening means, respectively,and/or by bringing the edge of the substrate into engagement with thefirst fastening means and the second fastening means, respectively. 9.The method according to claim 6, wherein the first fastening means isplaced in a reference corner of the frame of the substrate support, andthe substrate is aligned by placing the substrate in the definedposition determined by the first fastening means.
 10. The substrateprocessing device according to claim 1, the substrate support forsupporting the substrate comprises: at least a first fastening meansfixedly attached to the frame for aligning the substrate relative to theframe by attaching the substrate to the first fastening means; and atleast a second fastening means movably attached to the frame, the secondfastening means being movable relative to the frame and/or movablerelative to the substrate attached to the first fastening means.
 11. Thesubstrate support according to claim 10, wherein the second fasteningmeans is movable in a direction at least towards and/or away from theedge of the substrate attached to the first fastening means.
 12. Thesubstrate processing device according to claim 10, wherein the firstfastening means comprises at least a first retainer element and a secondretainer element.
 13. The substrate processing device according to claim10, wherein the first fastening means is arranged on the frame to definea reference corner for retaining, aligning and/or fixedly attaching thesubstrate relative to the substrate support in a reference position. 14.The substrate processing device according to claim 10, wherein thesecond fastening means comprises at least a third retainer element and afourth retainer element.
 15. The substrate processing device accordingto claim 10, wherein the second fastening means is movably attached tothe substrate support by means of a linear guide for guiding theretainer elements on a linear path relative to the frame and/or relativeto the edge of the substrate received in the first fastening means in adirection substantially perpendicular to the edge of the substrate. 16.The substrate processing device according to claim 10, wherein thesecond fastening means comprises means for exerting a force in thedirection towards the edge(s) of the substrate received in the firstfastening means.
 17. The substrate processing device according to claim1, wherein the edge exclusion is arranged within the process chamber.18. The method according to claim 6, the step of providing the substratesupport includes providing at least a first fastening means fixedlyattached to a frame of the substrate support, and a second fasteningmeans movably attached to the frame, the second fastening means beingmovable relative to the frame.
 19. The method according to claim 6,wherein the step of attaching the substrate to the frame includes:moving the second fastening means in an outward direction to increase aspace defined by the position of the first fastening means and thesecond fastening means between the first fastening means and the secondfastening means; attaching the substrate to the first fastening means;moving the second fastening means in an inward direction towards an edgeof the substrate attached to the first fastening means; and attachingthe substrate to the second fastening means.